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<p>SOUTH PORTLAND, Maine–Fairchild Semiconductor International reported first quarter sales of $399.7 million, 8 percent higher than the prior quarter and 14 percent greater than the first quarter of 2003.</p>

Higher frequency, mechanical integrity and contact resistance pose added challenges to connector makers.

Removable Media

With up to a 256-Mbit/s total system data rate, these recording/reproducing systems will use media contained in interchangeable cartridges, giving you freedom of choice between tape, a ruggedized disk, or solid-state drives.”

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This media will also be able to be exchanged in seconds, and the chosen media cartridges will use two standard interfaces. A SCSI interface will provide a high-speed output to other Heim data download and analog replay systems that are fitted with media cartridge receivers. Such systems will provide reconstruction of the original data and digital data transfer as required on the ground in airborne applications.

On the other hand, an IEEE-1394 FireWire interface will support direct data download from a media cartridge to remote ground support equipment, with or without removing the cartridge from the D5000 system.

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The D5000 mainframe will have three module slots that can accommodate any combination of the existing and future D Series signal interface modules, including ones for analog, MIL-1553, PCM, ARINC429, and Ethernet signals, as well as voice, serial, parallel, video, and others.

New high channel-capacity signal modules will be able to be configured with up to 75 channels in a single mainframe. All connections to the system will be made through front-mounted multi-pin connectors.

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Using an integral IRIG time code reader/generator, a D5000 can also synchronize to external IRIG and GPS time sources. A packet recording system ensures accurate time tagging and consistent channel-to-channel phase relationships.

These systems are compatible with both Heim data format and the emerging IRIG106 Chapter 10 standard. You have permanent access to configuration and control functions through front-panel controls, backed up by remote control available through computer and discrete contact interfaces.

Camera-equipped cellular phones and digital cameras are examples of markets TSMC wants to better serve by expanding its 0.18-micron capacity. The company plans to introduce a higher-performance version of its CMOS sensor technology for the 0.18-micron node by the year's end.

Embedded-flash moduleEarlier this year, the company added an embedded-flash memory module to its 0.18-micron process based on a split-gate technology. The nonvolatile memory module is now being qualified and should be production-ready by the end of this quarter, said Ping Yang, vice president of research and development at TSMC.

Also on the company's nonvolatile memory agenda are new 0.18- and 0.25-micron modules based on a pure-logic process. Using this scheme, TSMC can embed small amounts of nonvolatile memory without using extra mask layers, Hu said. The modules are slated to appear in late 2004 and early 2005.

Targeting the liquid-crystal display market, the company plans to introduce three high-voltage processes between late 2004 and 2006, starting at 0.18 micron.

Despite its renewed emphasis on mature process technologies, the company is also reporting a substantive increase in demand for 0.13-micron process technology, and the company says it plans to double its capacity for 0.13-micron process technology this year vs. 2003. For the 90-nm node, the company has 40 products at various production and design stages; volume production is expected to begin by the second half of 2004.