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<p>A follow-on industry conference April 14-15 also will consider 3-D integration and packaging technologies. The conference will be co-hosted by RTI International (Research Triangle Park, N.C.)</p>

Founded in January 2000, Internet Machines developed switch fabrics and net processors for 10-Gbit routers until, the industry hit a speed bump,” deadpanned Frank Knuettel, president and CEO of newly renamed IMC.

LONDON — Fabless chip company TransChip Inc. (Ramat Gan, Israel) a specialist in integrated camera devices for mobile phones, phones and other multimedia-enabled devices, has raised $19 million in million in a Series D round.

The additional funds will be used for further product development, and to increase marketing and sales efforts.

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The Series D round was led by Redpoint Ventures and all previous TransChip investors participated, including Mission Ventures, Cadence Design Systems Inc., Ray Stata, co-founder and chairman of Analog Devices and Dr. Andrew Viterbi, co-founder of Qualcomm.

TransChip's TC5740 module is already being incorporated into CDMA and GSM mobile phones by leading OEM/ODM handset makers.

The company's TC5700 series are complete VGA camera modules that include an image sensor, programmable image processor and real-time JPEG Codec. The chips utilize complex algorithms to ensure optimum images even in difficult lighting situations.

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SAN JOSE, Calif.–The Fabless Semiconductor Association (FSA) said it has received industry support from over 60 companies for the development and future adoption of a quality intellectual property (QIP) industry metric.

The FSA is working with the VSI Alliance (VSIA), which is chartered with developing open standards for system-on-chip (SOC) development and IP integration. The FSA and VSIA formally announced a strategic alliance in October 2003 to work together to accelerate the adoption and rollout of an industry QIP metric.

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Designers are increasingly utilizing third-party IP to solve complex design problems. But increasing complexity is complicating these transactions, making IP more difficult to integrate and support, and variations in quality remain problematic.

Companies supporting QIP metric efforts include several IP suppliers: Advanced RFIC, ARM, Artisan Components, Barcelona Design, Cadence Design Systems, Dolphin Integration, Faraday, Lightspeed Semiconductor, Mobius Microsystems, MoSys, STARC, Synopsys, The VCX, Virage Logic and Virtual Silicon Technology.

I ett exempel med en DC/DC-omvandlare med inspänningen 6 V och utspänningen 3,5 V med rippelströmmen 5 A kan hybridkondensatorn och en kondensator med flytande elektrolyt jämföras:

Åtta 330 µF kondensatorer med flytande elektrolyt ger totalt ett ESR-värde på 0,0213 ohm. Med bara tre 330 µF hybridkondensatorer får man ESR-värdet 0,010 ohm, dvs bara hälften av ESR-värdet för den flytande elektrolyten.

Det resulterande ripplet är 0,107 V för kondensatorn med flytande elektrolyt och 0,05 V för hybridkondensatorn. Kort sagt; med hybridkondensatorer behöver man färre kondensatorer och man får dessutom bättre prestanda i tillämpningen.

En hybridkondensator är dyrare än en kondensator med flytande elektrolyt men om man tar hänsyn till att man behöver ett mindre antal så får man stora kostnadsbesparingar ändå. Tar man dessutom hänsyn till montagekostnaden (tre i stället för åtta kondensatorer) blir besparingarna ännu större.

I tillämpningen får man dessutom besparingar i kretskortsyta. I exemplet ovan blir besparingen 40 procent. Detta är speciellt viktigt allteftersom kraven på mindre utrustningar ökar.