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<p>Agilent Technologies , www.agilent.com</p>

Now, TSMC is offering a new multi-layer mask (MLM) service. MLM, which is not a new concept in the industry, promises to lower overall prototyping and IP verification costs. MLM is said to reduce NRE costs and the total number of reticles needed.

Scottsdale, AZ— AdvancedIO Systems today announced the V1120, the first member of its V1100 family. The V1120 is the industry's first conduction-cooled XMC product for 10GbE connectivity and packet processing and aims to address emerging requirements for open-standard, extremely high-bandwidth networking and point-to-point connectivity.

The V1120 uses a Xilinx Virtex-5 FPGA to meet the requirements of high-performance real-time processing and recording applications. To accommodate large line-rate bursts of incoming sensor data, the V1120 can buffer up to 115,000 jumbo-frame Ethernet packets in its onboard SDRAM memory. Additional interface signals are provided to facilitate precise time synchronization and other application-specific functionality that requires deterministic, low latency access to the packets.

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V1100 is a family of rugged open-standard form factor modules connecting real-time embedded systems to each other or to extremely high-speed Ethernet networks. Following the widely used VITA 42.3 XMC mezzanine module format, V1100 integrates with standard off-the-shelf platforms, such as VXS and VPX blades, providing system developers with multiple platform options. The V1100 family supports AdvancedIO's udpXG protocol offload and streamXG data streaming acceleration cores and software. For easy integration and future software portability, AdvancedIO's V1100 also supports a standard sockets-based software API.

The first member of the V1100 family, the V1120, will be available Q4 2008. For more information visit www.advancedio.com.

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PARIS — Nokia Siemens Networks has joined the Multicore Association (Espoo, Finland), a non-profit organization tackling critical roadblocks for developing multicore-enabled systems, as an executive board member.

The Multicore Association supports the multicore ecosystem and includes vendors of processors, operating systems, compilers, development tools, debuggers, ESL/EDA tools, simulators, as well as application and system developers.

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As an executive board member, Nokia Siemens Networks said it will help determine the overall direction of the Multicore Association. It will notably contribute to the definition of new common interfaces that will benefit a significant portion of the multicore market place,” stated the company.

Nokia Siemens Networks' experience in this industry will help influence the hardware and software vendors to define and adopt standards that will help to promote better development environments for multicore solutions,” commented Markus Levy, president of the Multicore Association.

The ARC Media 401V Subsystem now is available for licensing by customers globally. Contact ARC for more information at

About ARC International

ARC International is a world leading provider of consumer IP to OEM and semiconductor companies globally. ARC's award-winning, vertically integrated audio and video solutions enable high quality multimedia content to be captured, shared, and played on a wide range of electronics devices. ARC's 140+ customers collectively ship hundreds of millions of ARC-Based£ chips annually in products such as Mobile TVs, Portable Media Players, WiFi-/WiMAX-enabled computers, flash storage, digital cameras, network appliances, and medical and government systems.

ARC International maintains a worldwide presence with corporate and research and development offices in San Jose and Lake Tahoe, Calif., St. Albans, England, and St. Petersburg, Russia. For more information visit www.ARC.com

Note: The above text is the public part of the press release obtained from the manufacturer (with minor modifications). EETimes Europe cannot be held responsible for the claims and statements made by the manufacturer. The text is intended as a supplement to the new product presentations in EETimes Europe magazine.